BGA and QFN SMT Assembly with X-Ray Inspection Support
YourSMT supports BGA, QFN and fine-pitch SMT assembly with controlled placement, reflow process awareness, X-ray inspection and engineering-reviewed RFQ support.
Hidden Solder Joints Need Strong Process Control
BGA and QFN packages create solder joints that cannot be fully verified by visual inspection alone. Controlled printing, placement, reflow and X-ray verification are important for reducing hidden assembly risk.
Inspection-backed SMT Assembly
YourSMT supports inspection planning for fine-pitch and hidden-joint PCBA projects. AOI, SPI and X-ray help verify process quality from solder paste to reflow result.
Buyer Preparation
To review a BGA or QFN project, provide BOM, package details, PCB finish, Gerber files, pick-and-place data, X-ray expectations and any functional test requirements.
Best-fit Applications
This service supports communication modules, industrial control boards, IoT electronics, test boards and other high-density assemblies that require reliable SMT process control.
RFQ Preparation
- BOM with manufacturer part numbers and acceptable alternates.
- Pick-and-place / centroid data for placement review.
- Gerber, stencil data or assembly drawings when available.
- Quantity, target lead time, inspection requirements, test notes and packing needs.
FAQ
Can YourSMT support prototype and low-volume PCBA?
Yes. YourSMT supports samples, NPI builds, validation lots and repeat low-to-mid volume PCBA production.
What files help speed up quotation?
BOM, pick-and-place data, Gerber or stencil information, quantity and target schedule are the most useful starting point.
Does YourSMT support inspection?
Yes. Depending on project needs, inspection support can include AOI, SPI, X-ray, first article review and final checks.
Do you support global customers?
Yes. YourSMT supports Taiwan and international buyers with English and Chinese communication for SMT / PCBA projects.